FILE PHOTO: A semiconductor wafer is placed on a microscope at the chip packaging firm Unisem (M) Berhad plant in Ipoh, Malaysia October 15, 2021. REUTERS/Lim Huey Teng/File Photo
FILE PHOTO: A semiconductor wafer is placed on a microscope at the chip packaging firm Unisem (M) Berhad plant in Ipoh, Malaysia October 15, 2021. REUTERS/Lim Huey Teng/File Photo